SikaBond®-T35

One-component polyurethane, moisture curing

12 months from date of production

Stored in undamaged original sealed containers, in dry conditions and protected from direct sunlight at temperatures between +10°C – 25°C (50°F and 77°F).

1.18 kg/L (9.85 lbs/US gal )

53 g/L

~ 50 (after 28 days)

1.05 MPa (150 psi) at 23°C (73 °F) and 50% r.h.

1.05 MPa (150 psi) using 1 mm adhesive thickness at 23 °C (73 °F) and 50% r.h.

-40 °C – +70 °C (-40 °F – +158 °F)

Consistency: Spreads easily, holds ridges after troweling

Room temperature between +15 °C (60 °F) and +35 °C (90 °F). For ambient temperatures the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Between 40% and 70% during installation is best for adhesive. See wood floor manufacturer for wood requirements.

During laying and until SikaBond®-T35 has fully cured, substrate temperature should be greater than +15 °C (60 °F) and in case of radiant heating, less than +20 °C (70 °F). For substrate temperatures, the standard construction rules are relevant.

Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. SikaBond®-T35 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not accep able, use Sika® MB. See Sika® MB technical data sheet for proper instruction on Sika® MB.

4.0 mm/24 hrs. at 23 °C (73 °F) and 50% r.h. Floor may accept light foot traffic after 6-8 hrs. (depending on climatic conditions and adhesive layer thickness).

~ 45 – 60 minutes at 23 °C (73 °F) and 50% r.h. 

• Engineered wood flooring: P5 Trowel: approximately 4.18 m² – 4.65 m²(45 – 50 SF/ US gal)
• Short hardwood solids including bamboo shorts max. 19 mm (3⁄4 ") thick: 6 mm x 6 mm x 6 mm (1⁄4 x 1⁄4 x 1⁄4 inch ) square notch trowel) approximately 2.79 m² – 3,72 m²(30-40 SF/ US gal)
• Coverage mus  be monitored to ensure accuracy of application. Trowel angle may prevent proper coverage.

Trowel size is recommended to obtain proper coverage. Larger sizes are acceptable. Excessive amounts of adhesive may cause wood flooring to slide while placing. Check coverage during installation. Trowels should be used at the 90° angle to subfloor to get stated coverages. Periodically check trowel for wear. Worn trowels must be replaced immediately.

Substrate Quality
Substrate must be clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, laitance and other poorly adhering particles must be removed by mechanical means.

SikaBond®-T35 can be used on properly prepared, structurally sound concrete, cementitious patch/underlayments, chipboards, ceramic tiles, plywood. For on-grade sub-floors Sika recommends the use of Sika® MB for best protection against sub-floor moisture – moisture testing is required by the wood flooring manufacturer. For best results with the wood flooring products. Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from sub-floor and in-room humidity extremes. Sika recommends the use of Sika® MB over any dry, gypsum based sub-flooring to enhance surface strength. Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All concrete, cement screed and gypsum based subfloors must be structurally sound, clean, dry, smooth; free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants Thoroughly clean with an industrial vacuum. Remove laitance or weak areas mechanically and thoroughly. For application over ceramic tiles it is necessary to grind tile surfaces and clean thoroughly with an industrial vacuum. For substrates with old well bonded adhesive or adhesive residue use Sika® MB – see Sika® MB data sheet for installation instructions and proper details. If surface contains asphalt (cutback) adhesive follow the Resilient Floor Covering Institute “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed use Sika® MB to help promote adhesion to the subfloor – or use an industry approved levelling compound over the cutback residue. SikaBond®-T35 will adhere to most common patching/levelling compounds. Due to differences in asphalt based adhesive types and performance capabilities; applicator must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/level compound. Due to differences in asphalt-based adhesive types and performance capabilities, applicators must verify that preparation of the surface is sufficient prior to using Sika® MB or patch/ level compound. For unknown substrates, please contact Sika® Technical Services for best practices at 1-800-933-SIKA.

Substrate Temperature: During laying and until SikaBond®-T35 as fully cured, substrate temperature should be greater than +15 °C (59 °F) and in case of in?floor heating systems, less than +20 °C (68 °F). For substrate temperatures, the standard construction rules are relevant.

Air Temperature: Room temperature must be between +15 °C (59 °F) and +32 °C (90 °F). For ambient temperatures, the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.

Substrate Humidity:

For use as an adhesive only: SikaBond®-T35 is not affected by moisture or vapor transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond®-T35 at recommended coverage rate as All-in-One or Sika® MB. See Technical Data Sheet for proper instruction.

For use as an adhesive and membrane: Concrete moisture vapor emission rate (MVER) may not exceed 5,44 kg per 92,9 m2 (15 lb/1 000 ft2) per 24 hours, anhydrous calcium chloride test (ASTM F1869). Do not install when the relative humidity (RH) of the concrete slab exceeds 90 % (ASTM F2170).

Relative Air Humidity: Between 40 % and 70 %

All tools should be cleaned immediately after use with Sika® Urethane Cleaner and Thinner. Any adhesive that is permitted to cure on the tools will need to be removed by mechanical means. Use a dry cloth or Sika® Hand Cleaner towels to remove adhesive from pre-finished wood surfaces before it cures. Finger prints or small amounts of adhesive residue can be removed from pre-finished wood using the Sika® Hand Cleaner towels. Sika® Hand Cleaner towels use a citrus based cleanser that will not harm the floor finish.