SikaBond®-T55
LOW VOC, TROWEL-APPLIED POLYURETHANE ADHESIVE FOR WOOD FLOORING
SikaBond®-T55 is a low-VOC, super-strong, one component polyurethane adhesive for full surface woodfloor bonding. Along with its physical characteristics, including permanent elasticity, SikaBond®-T55 has been specifically formulated to be exceptionally easy to trowel, preventing arm strain and increasing productivity.
- 400 % Elongation
- Reduces stress on the substrate: the elastic, material-compatible adhesive reduces transverse stress between the wood floor and the substrate
- Extremely easy to spread, helping to accelerate installation and increasing productivity
- Fast-curing: unfinished wood flooring can be sanded after 12 hours of cure time
- Suitable for most common types of wood floors
- Especially good for problematic woods such as beech and bamboo
- Bonds solid wood flooring up to 19 mm (¾ in.) thick and 203 m (8 in) wide, and engineered planks up to 355 mm (14 in) wide directly to concrete without length limitations
- Suitable for in-floor radiant heat installation
- Permanently elastic; allows planks to expand and contract without reduction of bond.
- Does not contain water
- Suitable for bonding wood floors directly onto old ceramic tiles eliminating need for removal
- Footfall-sound-dampening adhesive, helping to create a quieter environment
- Eliminate sleepers and plywood over concrete substrates
Usage
- Bonding of solid and engineered wood flooring (strips, longstrips, planks, panels, boards) mosaic parquet, industrial parquet, wood paving (residential) as well as chipboards
Advantages
- 400 % Elongation
- Reduces stress on the substrate: the elastic, material-compatible adhesive reduces transverse stress between the wood floor and the substrate
- Extremely easy to spread, helping to accelerate installation and increasing productivity
- Fast-curing: unfinished wood flooring can be sanded after 12 hours of cure time
- Suitable for most common types of wood floors
- Especially good for problematic woods such as beech and bamboo
- Bonds solid wood flooring up to 19 mm (¾ in.) thick and 203 m (8 in) wide, and engineered planks up to 355 mm (14 in) wide directly to concrete without length limitations
- Suitable for in-floor radiant heat installation
- Permanently elastic; allows planks to expand and contract without reduction of bond.
- Does not contain water
- Suitable for bonding wood floors directly onto old ceramic tiles eliminating need for removal
- Footfall-sound-dampening adhesive, helping to create a quieter environment
- Eliminate sleepers and plywood over concrete substrates
Packaging
18.9 L (5 US gal.) pail
Colour
Tan
Product Details
ENVIRONMENTAL INFORMATION
- VOC Content: 53 g/L - SCAQMD, Rule 1168 compliant (100 g/L limit for Wood Flooring Adhesive Category)
Shelf Life
12 months from date of manufacture, if stored in undamaged, original, sealed containers.
Storage Conditions
Store dry at temperatures between 10 and 25 °C (50 and 77 °F) and protect from direct sunlight.
Density
| 1.34 kg/L (11 lb/gal) |
|
Shore A Hardness
| 35 | (28 days at +23 °C (73 °F) and 50 % R.H.) |
Tensile Strength
| 1.5 MPa (217 psi) | (28 days at +23 °C (73 °F) and 50 % R.H.) |
Shear Strength
| ~1 MPa (145 psi) using 1 mm adhesive thickness | (28 days at +23 °C (73 °F) and 50 % R.H.) |
Service Temperature
-40 °C to +70 °C (-40 °F to 158 °F)
Application
Sag Flow
Consistency: Spreads very easily, holds ridges after troweling.
Substrate Moisture Content
Moisture requirements are set forth to protect the wood flooring products that can expand and contract with different moisture levels. SikaBond®-T55 is not affected by moisture or vapor transmission. The guidelines below are included to provide the best practices in moisture vapor testing that exists today. Permissible substrate moisture contents are listed on the chart below. For more information on the use of the CM method please contact your Sika Canada Technical Sales Representative.
| Application | Moisture level requirements using Tramex method (%) | Moisture level requirements using CM method (%) |
| 3/4” solid or engineered over concrete | 4 % | 2.5 % |
| 3/4” solid or engineered over concrete with Sika® MB layer | 6 % | 4.0 % |
| 3/4” solid or engineered over in-floor heating over concrete | 3 % | 1.8 % |
The National Wood Flooring Association recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based subfloor use the Tramex measuring device to find the highest reading in the application area and then run the CM method at that highest point to determine the worst case. As a general guideline for floors with no in-floor heating if the Tramex is below 4 % the Sika® MB will not be necessary and between 4 % and 6 % Sika® MB will be required - however, the CM method must be used to make final determination of concrete moisture levels – use chart above. For moisture content and quality of substrates the guidelines of wood floor manufacturer must be observed.
Curing Rate
4 mm /24 hours. Floor may accept light foot traffic after 4 hours and be sanded 12 hours after installation (depending on installation conditions and adhesive layer thickness).
Skin Time / Laying Time
| ~45 to 60 minutes | (at +23 °C (73 °F) and 50 % R.H.) |
Consumption
P5 Trowel: approx. 1.23 m2/L (50 ft2/US gal.)
In cases of bonding of long, wide boards or of uneven substrates, it may be necessary to use a trowel with larger notches to increase the thickness of the adhesive layer. Avoid hollow sections or bare patches. Excessive amounts of adhesive may cause the wood flooring to slide.
SUBSTRATE PREPARATION
Preparation is a critical step in the installation process and will ensure a successful, long-term, tenacious bond. Substrates must be structurally sound, clean, dry, level, free of voids, projections, loose materials. They must be free of oil, grease, sealers or any contaminants or conditions that may affect adhesion or overall product performances. They should be thoroughly cleaned with an industrial vacuum fitted with a brush attachment. For substrates with old, non-water soluble well-bonded adhesive or adhesive residue (other than adhesives with pressure-sensitive characteristics), use Sika® Primer MBCA. See relevant Product Data Sheet for application instructions and proper details.
SikaBond®-T55 can generally be used without priming on properly prepared, structurally sound - concrete, cement floors, chipboards, ceramic tiles, plywood and hardwood. For on-grade sub-floors Sika recommends the use of Sika® Primer MBCA for best protection against sub-floor moisture For best results with the wood flooring products, moisture testing is required by the wood flooring manufacturer. Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from extremes of sub-floor and in-room humidity.
For application over ceramic tiles, it is necessary to grind tile surfaces, removing any glaze and producing a matt, fine gripping surface and then clean thoroughly with an industrial vacuum with a brush attachment.
If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute’s “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed, use the Sika® Primer MBCA to help promote adhesion to the sub-floor, or use a Sika Level primer and levelling compound over the cutback residue. SikaBond®-T55 will adhere to most common patching/levelling compounds. Due to differences in asphalt based adhesive types and performance capabilities; applicator must verify that preparation of the surface is sufficient prior to using Sika® Primer MBCA or the Sika Level compound. For unknown substrates, contact your Sika Canada Technical Sales Representative.
Substrate Temperature: During laying and until SikaBond®-T55 has fully cured, substrate temperature should be greater than 15 °C (59 °F) and in case of in-floor heating systems, less than +20 °C (68 °F). For substrate temperatures, the standard construction rules are relevant.
Air Temperature: Room temperature must be between +15 °C (59 °F) and +32 °C (90 °F). For ambient temperatures, the standard construction rules are relevant. Follow all wood floor manufacturer’s acclimation and room temperature requirements.
Substrate Humidity: Moisture requirements are set forth to protect wood flooring products that can expand and contract with different moisture levels in the room. SikaBond®-T55 is not affected by moisture or vapour transmission. The guidelines below are included to provide the best practices in moisture vapour testing that exists today. Permissible substrate moisture contents are listed below:
| Application | Moisture level requirements using |
| 19 mm (3/4 in) solid or engineered wood over concrete | 4 % |
| 19 mm (3/4 in) solid or engineered wood over concrete with Sika® Primer MBCA layer | 6 % |
| 19 mm (3/4 in) solid or engineered wood over in-floor heating over concrete | 3 % |
The NWFA (National Wood Flooring Association) recommends the use of moisture testing devices that identify actual moisture content in percentages (%). For best results in measuring the moisture levels in cement based sub-floors, use a Tramex moisture meter to find the highest reading in the application area. As a general guideline for floors with no in-floor heating, if the Tramex reading is below 4 %, the Sika® Primer MBCA will not be necessary; and between 4 % and 6 %, Sika® Primer MBCA will be required. For moisture content and quality of substrates, the wood floor manufacturer’s guidelines should be observed.
Relative Air Humidity: Between 40 % and 70 %
CLEAN UP
All tools should be cleaned immediately after use with Sika® Urethane Cleaner and Thinner. Any adhesive that is permitted to cure on the tools will need to be removed by mechanical means. Use a dry cloth and Sika® Hand Cleaner towels to remove adhesive from pre-finished wood surfaces before it cures. Finger prints or small amounts of adhesive residue can be removed from pre-finished wood using the Sika® Hand Cleaner towels. Sika® Hand Cleaner towels use a citrus based cleanser that will not harm the floor finish.
FAQ
During laying and until SikaBond®-T55 has fully cured, substrate temperature should be greater than +15 °C (59 °F) and in case of in-floor heating systems, less than +20 °C (68 °F). For substrate temperatures, the standard construction rules are relevant.
SikaBond-T55® is suitable for most common types of wood floors.
Bonding of solid and engineered wood flooring (strips, long strips, planks, panels, boards) mosaic parquet, industrial parquet, wood paving (residential) as well as chipboards.
SikaBond-T55® is Especially good for problematic woods such as beech and bamboo
No, SikaBond®-T55 eliminates sleepers and plywood over concrete and gypsum substrates.
Yes, SikaBond®-T55 is suitable for in-floor radiant heat installation
P5 Trowel: approx. 1.23 m2/L (50 ft2/US gal.)
In cases of bonding of long, wide boards or of uneven substrates, it may be necessary to use a trowel with larger notches to increase the thickness of the adhesive layer. Avoid hollow sections or bare patches. Excessive amounts of adhesive may cause the wood flooring to slide.
4 mm /24 hours.
Floor may accept light foot traffic after 4 hours and be sanded 12 hours after installation (depending on installation conditions and adhesive layer thickness).
~45 to 60 minutes at +23 °C (73 °F) and 50 % R.H.
SikaBond®-T55 can generally be used without priming on properly prepared, structurally sound - concrete, cement floors, chipboards, ceramic tiles, plywood and hardwood. For on-grade subfloor Sika recommends the use of Sika® Primer MBCA for best protection against subfloor moisture. For best results with the wood flooring products, moisture testing is required by the wood flooring manufacturer. Below grade applications are generally not recommended unless proper precautions are taken to protect the wood flooring from extremes of subfloor and in-room humidity.
Preparation is a critical step in the installation process and will ensure a successful, long-term, tenacious bond. Substrates must be structurally sound, clean, dry, level, free of voids, projections, loose materials. They must be free of oil, grease, sealers or any contaminants or conditions that may affect adhesion or overall product performances. They should be thoroughly cleaned with an industrial vacuum fitted with a brush attachment. For substrates with old, non-water soluble well-bonded adhesive or adhesive residue (other than adhesives with pressure-sensitive characteristics), use Sika® Primer MB CA. See relevant Product Data Sheet for application instructions and proper details.
For application over ceramic tiles, it is necessary to grind tile surfaces, removing any glaze and producing a fine, mat gripping surface and then clean thoroughly with an industrial vacuum with a brush attachment. If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute’s “Recommended Work Practices” for removal. When the asphalt (cutback) adhesive is sufficiently removed, use the Sika® Primer MBCA to help promote adhesion to the sub-floor, or use a Sika Level primer and levelling compound over the cutback residue. SikaBond®-T55 will adhere to most common patching/levelling compounds. Due to differences in asphalt based adhesive types and performance capabilities; applicator must verify that preparation of the surface is sufficient prior to using Sika® Primer MBCA or the Sika Level compound. For unknown substrates, contact your Sika Canada Technical Sales Representative.
Room temperature must be between +15 °C (59 °F) and +32 °C (90 °F). For ambient temperatures, the standard construction rules are relevant. Follow all wood floor manufacturers’ acclimation and room temperature requirements.
Moisture requirements are set forth to protect wood flooring products that can expand and contract with different moisture levels in the room. SikaBond®-T55 is not affected by moisture or vapour transmission.
Les exigences en matière d’humidité sont émises dans le but de protéger les revêtements de bois en permettant leur dilatation et leur contraction selon la variation de l’humidité ambiante. SikaBond®-T55 n’est pas affecté par l’humidité ni la transmission de la vapeur d’eau.
Between 40 % and 70 %
SikaBond®-T55 is applied to the properly prepared substrate directly from the pail and uniformly distributed by notched trowel. Take care to place only enough adhesive to allow sufficient time to place wood flooring into adhesive while adhesive is still very wet. A general rule is to apply the wood flooring within 20 to 25 minutes of applying the adhesive under normal temperature and humidity conditions. The SikaBond®-T55 is moisture cured adhesive and will cure faster in more humid environments. - Do not let a skin form on the adhesive prior to applying the wood flooring. Press the wood floor elements firmly into the adhesive so that the wood floor underside is sufficiently wetted. The elements can then be joined together using a hammer and an impact block and/or rubber mallet. Many types of wood floors have to be tapped from the top. Leave gaps at room perimeters and at any floor wall partition to allow wood flooring to move naturally. The wood floor manufacturer’s laying instructions, as well as standard construction rules, must be observed.
Note: Wood floor manufacturer’s requirements for room humidity levels and environmental control along with wood flooring acclimatization requirements must be strictly followed. For solid wood installations, Sika Canada recommends the use of clamps to keep joints tight and weights to rest on the wood while the adhesive cures.
Do not use on PE, PP, TEFLON, and certain plasticized synthetic materials. Some primers can also negatively influence the bond of SikaBond®-T55 (Carry out pre-start trials on unusual substrates and where existing primers remain to assess compatibility and adhesion).
Do not use on wet, contaminated, or friable substrates.
Solid wood < 203 mm (< 8 in)
