Product Data Sheet Safety Data Sheet Show all documents
SikaBond®-52 Parquet

SikaBond®-52 Parquet

Solvent-free Elastic Bonding and Acoustical Dampening for Wood Floors

SikaBond®-52 Parquet is a 1-component, solvent-free, elastic wood flooring adhesive for professional use. Ideal for bonding wood floors using liquid batten/beaded application. Use with solid, engineered, parquet wood floors and chipboard.

  • Floors can be sanded after 12 hours
  • Very low emissions
  • Suitable for in-floor radiant heat installation 
  • Reduces stress transfer between the wood floor and the substrate
  • Suitable for bonding directly onto old ceramic tiles
  • Elastic
  • Footfall-sound dampening properties
  • Adhesive can be sanded
  • 1-component, ready to use
  • Fast curing properties
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness)
  • Excellent workability, very easy to extrude.
  • Good initial tack
  • Elastic, footfall sound-dampening adhesive
  • Suitable for most common types of wood floors
  • Especially suitable for problematic woods including beech, maple and bamboo
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate
  • Suitable for use with subfloor heating
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded
  • Solvent free
Product Data Sheet Safety Data Sheet Show all documents

Usage

For Full Surface bonding: Solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial par?quet, lam parquet, wood paving (residential) as well as chipboard, plywood and OSB can be bonded For the Sika® AcouBond®-System: Solid wood boards (tongued and grooved), 3-ply engineered wood, chipboard, plywood and herringbone blocks can all be bonded. For detailed application instructions refer to the Product Data Sheet of the Sika® AcouBond®-System, or contact our Technical Department For Beaded Application: Solid wood boards, 3-ply engineered wood and chip?board can be bonded

Advantages

  • Floors can be sanded after 12 hours
  • Very low emissions
  • Suitable for in-floor radiant heat installation 
  • Reduces stress transfer between the wood floor and the substrate
  • Suitable for bonding directly onto old ceramic tiles
  • Elastic
  • Footfall-sound dampening properties
  • Adhesive can be sanded
  • 1-component, ready to use
  • Fast curing properties
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness)
  • Excellent workability, very easy to extrude.
  • Good initial tack
  • Elastic, footfall sound-dampening adhesive
  • Suitable for most common types of wood floors
  • Especially suitable for problematic woods including beech, maple and bamboo
  • Suitable for bonding wood floors directly onto old ceramic tiles
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate
  • Suitable for use with subfloor heating
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded
  • Solvent free

Packaging

600 mL foil pack /(20 US fl. oz) 20 foil packs per box

1800 mL foil pack / (60 US fl. oz) 6 foil packs per box

Colour

Parquet brown

Product Details

Sustainability / Certifications / Approvals

ENVIRONMENTAL INFORMATION

  • LEED® EQc 4.1
  • SCAQMD, Rule 1168
  • BAAQMD, Reg. 8, Rule 51
Product Information

Composition / Manufacturing

i-Cure Technology polyurethane

Shelf Life

SikaBond®-52 Parquet has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

Storage Conditions

SikaBond®-52 Parquet shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C ( 41°F and 77 °F)

Density

1.30 kg/L approx.

(ISO 1183-1)
Technical Information

Shore A Hardness

35 approx. (after 28 days)

(ISO 868)

Tensile Strength

1.4 MPa approx. (203 psi)

(ISO 37)

Shear Strength

1.1 MPa (159 psi) approx., 1 mm (3/64 in) adhesive thickness

(ISO 17178)

Service Temperature

+5 °C to +40 °C (41 °F to 104 °F)

Application

Application Information

Sag Flow

SikaBond®-52 Parquet maintains stable trowel marks.
SikaBond®-52 Parquet is easily applied using guns or SikaBond® Dispensers.

Ambient Air Temperature

+15 °C to +35 °C (59 °F to 95 °F)

Relative Air Humidity

40 % to 70 %

Substrate Temperature

During laying and until SikaBond®-52 Parquet has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C (59 °F and 95 °F) without and between +20 °C and +35 °C (68 °F to 95 °F) with underfloor heating.

Substrate Moisture Content

Permissible substrate moisture content of the concrete substrate without underfloor heating using Tramex method: 4 % 

Permissible substrate moisture content for use with underfloor heating: 3 % 

Note: For all moisture contents, the quality of the substrates and surfaces, always follow the guidelines of the wood flooring manufacturer

Curing Rate

4 mm / 24 hours  [+23 °C (73 °F) / 50 % R.H.)]

Skin Time / Laying Time

60 minutes approx. (+23 °C (73 °F)/ 50 % R.H.))

Consumption

Consumption

Sika® AcouBond®-System:

  • Approx 1.24 m2 (13.4 ft2) per 600 mL sausage (1 box of 20 x 600 mL sausages covers 25 m2 (269 ft2)). 1 box of 20 x 600 mL SikaBond®-52 Parquet sausages is required for every 1 roll of SikaLayer®-03. All cut-outs  must be filled. Use application tip with triangular cut-out to an 8 x 10 mm (0.32 x 0.4 in) opening.

Full Surface Bonding with SikaBond® Dispenser:

  • For full surface bonding with the SikaBond® Dispenser please refer to the Method Statements of the SikaBond® Dispenser series.

Beaded Application:

  • 44 mL approx. (1,55 oz)  per running meter consumes 250–500 g/m2  (0,56- 1,12 oz per ft2) depending on bead spacing (solid wood boards, 3-ply engineered wood, chipboards).
Application steps

APPLICATION INSTRUCTIONS

For the application of SikaBond®-52 Parquet all standard construction guidelines are relevant. For further information, please refer to the Method Statements "Full Surface Bonding" and "SikaBond® Dispenser".

SUBSTRATE PREPARATION

Preparation is a critical step in the installation process and will ensure a successful long term tenacious bond. All substrates must be structurally sound, clean, dry, smooth, free of voids, projections, loose materials, oil, grease, sealers and other surface contaminants or any contaminants or conditions that may affect adhesion or overall product performances. They should be thoroughly cleaned with an industrial vacuum scrubbing the surface with a brush attachment. Remove laitance or weak areas mechanically. For application over well bonded exiting ceramic tiles. It is necessary to grind tile surfaces and eliminate residue with an industrial vacuum with a brush attachment. 

CLEAN UP

All tools should be cleaned immediately after use with Sika® Cleaning Wipes-120. Any adhesive left to cure on the tools will need to be removed by mechanical means. Use a dry microfibre cloth and Sika® Cleaning Wipes-120 to remove small amount adhesive residue from pre-finished wood surfaces before it cures. Always test Sika Cleaning Wipes-120 in an uncoupicous area of the wood floor (or on a left piece of the wood floor) to confirm no harm to the floor finish. 

Documents