Sikafloor®-222 W ESD

• Conformity with LEED®v4 MR Credit (Option 1): Building Product Disclosure and Optimization – Environmental Product Declarations
• Conformity with LEED®v4 MR Credit (Option 1): Building Product Disclosure and Optimization - Material Ingredients
• Conformity with LEED®v4 MR Credit (Option 1): Building Product Disclosure and Optimization - Sourcing of Raw Materials

Meets the requirements of CFIA and USDA for use in food plants.

12 months when stored in original, unopened packaging.

Store dry at temperatures between 5 °C to 32 °C (41 °F to 89 °F).

Protect from freezing. If frozen, discard.

~40 %

~34 g/L

A:B= 1:4.57 by volume (mix full units only)

Minimum 18 °C (65 °F)   Maximum 30 °C (86 °F)

Minimum 10 °C (50 °F)   Maximum 30 °C (85 °F)

Mixing and application attempted at material, ambient and/or substrate temperature conditions less than 18 °C (65 °F) will result in a decrease in product workabitity and slower cure rates.

Maximum 75 % (during application and curing).

High humidity will result in extended cure time and water will be retained in the film reducing ultimate coating performance.

Substrate must be at least 3 °C (5 °F) above the Dew Point to reduce the risk of condensation, which may lead to adhesion failure or "blushing" on the floor finish. Be aware that the substrate temperature may be lower than the ambient temperature.

Minimum 10 °C (50 °F)   Maximum 30 °C (86 °F)

Moisture content of concrete substrate must be ≤ 4 % by mass (pbw – part by weight) as measured with a Tramex®CME / CMExpert type concrete moisture meter on mechanically prepared surface according to this product data sheet (preparation to ICRI / CSP 3 - 4). Do not apply to concrete substrate with moisture levels exceeding 4 % mass (pbw – part by weight) as measured with Tramex® CME / CMExpert type concrete moisture meter.

If moisture content of concrete substrate exceeds 4 % by mass (pbw – part by weight) as measured with Tramex® CME / CMExpert type concrete moisture meter, use Sikafloor®-1610 or Sikafloor®-81 EpoCem®CA or Sikafloor® 22NA or 24NA PurCem®.

When relative humidity tests for concrete substrate are conducted per ASTM F2170 for project specific requirements, values must be ≤ 85 %. If values exceed 85 % according to ASTM F2170, use Sikafloor®-1610 or Sikafloor®-81 EpoCem®CA or Sikafloor® 22NA or 24NA PurCem®.  ASTM F2170 testing is not a substitute for measuring substrate moisture content with a Tramex® CME / CMExpert type concrete moisture meter as described above.

IMPORTANT: Do not apply Sikafloor®-222 W ESD directly onto concrete substrates. Use of a Sikafloor® adhesion and isolation layer primer are required prior to the application of Sikafloor®-222 W ESD.

~25 minutes at 20 °C (68 °F)

Note: Care must be taken not to use product beyond its recommended pot life.  Material will appear liquid, but is unusable and will result in poor adhesion and or reduced conductivity.

Before applying Sikafloor® ESD body coat over Sikafloor®-222 W ESD.

Curing times will vary according to air and substrate temperature and relative humidity.

Water-borne products require moisture to evaporate from the film to cure to full properties. Provide adequate fresh air ventilation to remove the excess moisture from the curing product.

Protect from dampness, condensation and water contact during the initial 72 hour cure period.

Mechanical, chemical and physical properties will be fully achieved at full cure.

~6.6 m²/L to ~9.8 m²/L (~267 ft²/US gal. to ~401 ft²/ US gal.) 4 mil to 6 mil w.f.t.

NOTE: Do not exceed 6 mil. Product will not cure properly if applied at excessive thickness. 

Actual coverage rates and material consumption will depend upon surface porosity, substrate profile and wastage. Test sections are recommended to establish correct coverage.

Mixing Ratio - A:B = 1:4.57 by volume (mix full units only)

Do not hand mix Sikafloor® materials. Mechanically mix only. 

Do not thin this product. Addition of thinners (e.g. water, solvent, etc.) will slow cure and reduce ultimate properties of this product. Use of thinners will void any applicable Sika warranty.

Pre-mix the two components separately to ensure product uniformity.  The Part A (resin) container is partly filled and sized to allow use as the mixing vessel for a single unit. Start mixing the resin at low speed (300 - 400 rpm), to minimize air entrapment, using a drill fitted with an Exomixer® or Jiffy type mixing paddle (recommended model) suited to the volume of the mixing vessel. Add the Part B (hardener) to the Part A (resin) and mix for three (3) minutes until a uniform colour and consistency is achieved. During the mixing operations, scrape down the sides and bottom of the container with a flat or straight edge trowel at least once to ensure complete mixing.  Do not mix more material than can be applied within the working time limits (i.e. Pot Life) at the actual field temperature.

Note: Mixing attempted at material and ambient temperatures below 18 °C (65 °F) will result in a decrease in product workability.

Adhesion and Isolation Layer Primer:

Use of a Sikafloor® epoxy adhesion and isolation layer primer on concrete substrates and on existing ESD or epoxy coatings is required. Prime with either Sikafloor®-156CA, Sikafloor®-1610 or Sikafloor® -261CA. Allow the primer to cure (varies with temperature and humidity) until tack-free before applying subsequent coats. Ensure that the primer is pore- and pinhole-free and provides uniform and complete coverage over the entire substrate. Please refer to the individual most current and respective selected Sikafloor® Product Data Sheet for specific and detailed information.

Electrical Grounding:

The installation of an adhesion and isolation layer primer to seal the substrate is required. Embedded grounding points, such as copper tape, grounding snaps, etc., must be placed on top of the cured adhesion and isolation layer primer prior to installation of Sikafloor®-222 W ESD conductive primer .

Sikafloor®-222 W ESD conductive primer coating must be applied in direct, uninterrupted contact with properly prepared grounding points. Metal floor joints, metal equipment bases and steel columns or posts may be used if they have been electrically tested to confirm permanent continuity with an earth ground. A minimum of one (1) grounding point per every 93 m² (1,000 ft²) of flooring should be established, with a minimum of two (2) ground connections for any isolated area less than 93 m² (1,000 ft²) in order to achieve proper dissipation of static electricity. Adhesive backed copper grounding tape can be used as a grounding point. Copper tape can also be used to bridge non moving contraction joints, isolation joints around columns or construction joints between different concrete slabs. Copper tape and Sikafloor®-222 W ESD cannot be expected to maintain integrity over expansion joints that experience wide movement.

Methods of Grounding:

Installation methods include, but are not limited to, the following techniques:

1. Use copper tape to make an electrical connection with the green wire or grounding portion of an electrical outlet. A 100 mm (4 in) portion of the copper tape is adhered to the cured adhesion and isolation layer primer directly beneath the first coat of Sikafloor®-222 W ESD conductive primer. Run the remaining tape up the wall and attach it to the electrical outlet. A variation of this technique involves dropping a No. 10 or 12 copper wire, inside the wall from any convenient ground bus so that the wire emerges at the floor/wall junction. At this point, a small hole cut into the drywall or chipped out of the concrete to allow the copper wire to emerge. The copper grounding strip is intertwined with, or soldered to, the stranded copper wire. If intertwined, use a conductive adhesive tape to secure the copper tape with the copper wire. Insert the connection of the copper tape and wire into the wall. The balance of the grounding strip, typically 100 mm (4 in) is then adhered to the primed floor.

2. The copper tape can be used to make ground connections with steel columns. A 100 mm (4 in) portion of copper tape is adhered to the cured adhesion and isolation layer primer with remaining tape run up onto a lightly sanded steel column or base. Drill and tap a hole into the steel column or base; secure the copper tape using a machine screw and washer.

IMPORTANT:  All electrical grounding and associated electrical work should be undertaken and assessed by suitable trained, qualified and certified electrical personnel.

Intermediate Conductive Primer Coat:

Only start application of Sikafloor®-222 W ESD after the selected adhesion and isolation layer epoxy primer coat has dried tack-free, otherwise there is a risk of wrinkling or impairing conductive properties.  Grounding points must be installed before the application of Sikafloor®-222 W ESD. The floor should be divided into sections (at expansion joints or doorways when possible) that can be completed without interruption. When ending a section, tape it off to form a uniform, straight and clean edge for an adjacent section.

  
Mix and apply Sikafloor®-222 W ESD by brush and 10 mm (3/8 in) nap roller and roller trays;  450 mm (18 in) roller assemblies and trays are preferred. The roller should be wet in the tray well, then remove excess coating by lightly rolling in the upper tray slope area to spread coating evenly on the roller to avoid drips. Apply 3 pairs of 1.80-2.40 m (6-8 ft) long paths on to the floor. Then spread the material with roller passes perpendicular to the paths of coating. It is extremely important to apply the coating at a rate of 4-6 mil to achieve proper appearance, texture, and color development, and consistent ESD properties. Properly applied Sikafloor®-222 W ESD will exhibit a uniform dull black finish.

  
NOTE: Avoid puddling and excessive thickness. Areas applied too thick will “skinning over” which will result in soft, uncured product on the floor and unacceptable conductivity readings. Do not exceed recommended application thickness. Beware of pockets, “bug holes” or other depressions in the concrete surface where Sikafloor®-222 W ESD may accumulate during application. When applied too thin the coating will appear very flat in sheen and may exhibit poor electrical properties. Examine the cured Sikafloor®-222 W ESD surface for non-uniform appearance which may indicate areas where the product was applied in excessive thickness or too thin. These areas must be removed, prepared again and recoated prior to application of the selected Sikafloor® ESD body coat.

Test the applied Sikafloor®-222 W ESD for conductivity prior to the application of the selected Sikafloor® ESD body coat. A value of < 2.0 X 10⁴ ohms should be achieved as per ANSI/ESD S7.1 or ASTM F-150. Deficient areas must be removed, prepared again and recoated prior to application of the selected Sikafloor^® ESD body coat.

Clean tools and equipment immediately with Sika^® Epoxy Cleaner. Once hardened, product can only be removed manually or mechanically.