SikaBond®-T21

• Contributes towards satisfying LEED® v4 EQ Credit - Low-Emitting Materials
• Contributes towards satisfying LEED®v4 MR Credit - Building Product Disclosure and Optimization - Sourcing of Raw Materials (Option 1: Raw material source and extraction reporting): 

• Independently tested to -STC 62 (ASTM E-90) [168 mm (6 in)] concrete slab, 5/8 in (19 mm) suspended gypsum ceiling)
• Reduction of Impact Sound Δ IIC = 21 (ASTM E-2179)

12 months from date of manufacture, in its original, undamaged and sealed container.

Store dry at temperatures between 10 °C and 25 °C (50 °F and 77 °F) and protect from direct sunlight.

Water Vapour Permeability  < 4 g/m2-24h-mmHg per ASTM E96 (Standard Test Method for Water Vapor Transmission of Materials)

-

Specific Gravity  1.18 kg/L (9.85 lb/gal)

-40 °C to 70 °C (-40 °F to 158 °F)

Consistency: Spreads very easily

For use as an adhesive only:
SikaBond®-T21 is not affected by moisture or vapour transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond®-T21 at recommended coverage rate as All-in-One or Sika® MB. See Product Data Sheet for proper instruction.

For use as an adhesive and moisture membrane:
Concrete must be visibly dry. Inspect for any wetness at base of drywall or visible signs of moisture on concrete. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/ or moisture problems. When properly applied in accordance with Sika®
guidelines, SikaBond®-T21 provides unlimited moisture vapour protection.

Floor may accept light foot traffic after:

• 6  to 8 h at 1.1 - 1.2 m²/L (45 - 50 ft²/US gal) (P5 trowel)
• 12 h at 0.73 - 0.86 m²/L (30 - 35 ft²/US gal) (SC+MB trowel)

(depending on climatic conditions and adhesive layer thickness)

Floor can be sanded after 18 hours

For use as an adhesive and membrane:
Use All-in-One SC+MB trowel or 1/4” x 1/4” V-notch trowel (for moisture vapour and sound reduction membrane and bonding)

SC+MB Trowel or 1/4” x 1/4” V-notch: approx. 0.73 - 0.86 m²/L (30 - 35 ft²/US gal) required for vapour and sound retarding membrane.

SikaBond®-T21 requires the use of an SC +MB or 1/4 x 1/4 V notch trowel for application, with larger notch sizes also being acceptable.

P5 trowels should be used at 90° angle to the subfloor to achieve the stated coverages, while a SC+MB trowel or 1/4” x 1/4” V-notch trowel should be used at 45° angle.

The Applicator is responsible for periodic inspection of the trowel to check for excessive wear. If the trowel is found to be a defective, it should be replaced immediately to assure recommended coverage.
In cases of uneven substrates, it may be necessary to use a trowel with larger notches to increase the thickness of the adhesive layer. Avoid hollow sections or bare patches. Excessive amounts of adhesive may cause wood flooring to slide.
Coverage must be monitored to ensure accuracy of application. Improper trowel angle may prevent proper coverage.

The subfloor must be must be structurally sound, clean, dry, level and free from oils, bituminous materials, curing compounds, grease, dust, loose particles, paint and other poorly adhering material. SikaBond®-T21 can generally be used without priming on properly prepared, structurally sound concrete, cement floors, particleboards, ceramic tiles, plywood and hardwood. Sika recommends the use of Sika^® Primer MB^CA over any dry, gypsum based subflooring to enhance surface strength. Maximum acceptable floor variation is 5 mm in 3.05 m (3/16 in in 10 ft).

Preparation is a critical step in the installation process and will ensure a successful, long-term, tenacious bond. Concrete substrates must be structurally sound, clean, dry, level, free of voids, projections, loose materials. They must be free of oil, grease, sealers and other surface contaminants or any contaminants or conditions that may affect adhesion or overall product performances. They should be thoroughly cleaned with an industrial vacuum agitating the surface with a brush attachment. For substrates with old, well-bonded adhesive or adhesive residue, use Sika^® Primer MB^CA. Consult the relevant Product Data Sheet for application instructions and proper details.
  

For application over ceramic tiles, it is necessary to grind tile surfaces, removing any glaze and producing a matt, fine gripping surface and then clean thoroughly with an industrial vacuum equipped with a brush attachement.

  
If surface contains asphalt (cutback) adhesive, follow the Resilient Floor Covering Institute’s Recommended Work Practices for removal. When the asphalt (cutback) adhesive is sufficiently removed, use the Sika^® Primer MB^CA to help promote adhesion to the sub-floor or use a Sika^® Level primer and levelling compound over the cutback residue. SikaBond®-T21 will adhere to most common patching/levelling compounds. Due to differences in asphalt based adhesive types and performance capabilities, the applicator must verify that preparation of the surface is sufficient prior to using Sika^® Primer MB^CA or the Sika^® Level compound. For unknown substrates, please contact your Sika Canada Technical Sales Representative.

 
Substrate Temperature: During laying and until SikaBond®-T21 has fully cured, substrate temperature should be greater than 15 °C (59 °F) and in case of in-floor heating systems, less than 20 °C (68 °F). For substrate temperatures, the standard construction rules are relevant.

 
Air Temperature: Room temperature must be between 15 °C (59 °F) and 35 °C (95 °F). For ambient temperatures, the standard construction rules are relevant.

 
Substrate Humidity:

For use as an adhesive only: SikaBond®-T21 is not affected by moisture or vapour transmission. For protection of the wood, follow the wood floor manufacturer’s requirements for subfloor moisture. If substrate is not acceptable, use SikaBond®-T21 at recommended coverage rate as an All-in-One system or use Sika^® Primer MB^CA. See Sika^® Primer MB^CA Product Data Sheet for proper instruction.

For use as an adhesive and moisture membrane: Concrete must be visibly dry. Inspect for any visible signs of moisture on concrete or wetness at details and junctures, i.e at base of drywall. Concrete and cement-based underlayments must be fully cured and free of any hydrostatic and/or moisture problems.

 
Relative Air Humidity: Between 40 % and 70 % during installation is best for adhesive. See wood floor manufacturer for wood requirements.

All tools should be cleaned immediately after use with Sika® Urethane Cleaner and Thinner. Any adhesive that is permitted to cure on the tools will need to be removed by mechanical means. Use a dry cloth and Sika® Hand Cleaner towels to remove adhesive from pre-finished wood surfaces before it cures. Finger prints or small amounts of adhesive residue can be removed from pre-finished wood using the towels. Sika® Hand Cleaner towels use a citrus based cleanser that will not harm the floor finish. Remove any adhesive residue from hands using the Sika® Hand Cleaner towels.